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The Journal of The Korea Institute of Intelligent Transport Systems Vol.2 No.2 pp.65-72
Chip 소자를 이용한 SSPA 설계 및 제작에 관한 연구
The Design and Implementation of SSPA(Solid State Power Amplifier) using chip device
Abstract
In this work a 6-stage hybrid power amplifier which can be used for the wireless communication systems for MMC(hficrowave Micro Cell) and ITS wireless communication system is designed and fabricated. Ihe power amplifier's each stages was fabricated Hetero-junction Power FET of bare chip type and an alumina substrate with =9.9 and 15-mil thickness. The measured results of power amplifier module showed 33.236.5 dB small signal gain, 33.034.0 dBm output power at forward frequency (17.6 GHa 17.9 CHz) and 36.037.0 dB small signal gain, 33.034.5 dBm output power at reverse frequency (19.0 GHz 19.2GHz).
